
High-Performance Liquid Cooling Solutions
Enabling the next generation of computing infrastructure.
Direct-to-Chip Cooling
Direct-to-Chip is the next-generation solution for high-performance computing environments.
Benefits:
Maximized Efficiency: Significantly reduces power consumption for cooling compared to air cooling.
Higher Density: Supports more powerful hardware in the same footprint without thermal throttling.
Lower Operational Costs: Energy savings translate into a faster ROI for data center operators.
Scalable for Growth: Ideal for AI, HPC, and enterprise workloads that demand consistent performance.
ThermoVerra DLC Services:
Design and integration of cold plate cooling systems.
End-to-end project management and installation.
Ongoing preventive maintenance and performance monitoring.
Immersion Cooling
Immersion cooling takes efficiency to the next level by submerging entire servers—or server components—into a non-conductive dielectric fluid. This method removes heat more efficiently than air or direct liquid cooling and virtually eliminates the need for fans.
Benefits:
Extreme Energy Efficiency: Significantly reduce cooling energy use.
Extended Hardware Life: Gentle, stable thermal environment lowers wear and tear.
Quiet Operation: Eliminates most moving parts for near-silent operation.
Ideal for AI & HPC: Handles the most heat-intensive workloads with ease.
ThermoVerra Immersion Cooling Services:
Immersion tank design, sourcing, and integration.
Rack conversion and retrofitting for immersion compatibility.
Fluid management, filtration, and replacement services.
Maintenance & Monitoring
ThermoVerra offers preventive maintenance and performance optimization programs to ensure your investment continues to deliver maximum performance and energy savings.
Benefits:
Protect Your Investment – Extend the lifespan of your cooling equipment and IT assets.
Predictable Costs – Avoid surprise downtime or costly emergency repairs.
Peace of Mind – Continuous optimal performance for AI, HPC, and mission-critical workloads.
ThermoVerra Maintenance & Monitoring Services:
Scheduled Inspections
Coolant Quality Management
Performance Monitoring
Component Replacement
Upgrade Planning
The Future of Compute
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AI and high-density compute environments can generate up to 10× the heat of traditional workloads, pushing hardware to its thermal limits. As utilization spikes and workloads scale, air cooling can cause thermal throttling, longer processing times, and reduced efficiency. Liquid cooling manages this thermal load in real time, keeping systems running at peak efficiency.
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Liquid cooling can reduce total energy use by 10–50% compared to air cooling. It improves PUE by lowering cooling energy demand, while also cutting fan power and reducing airflow management costs.
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Liquid cooling supports power densities up to 100kW per rack. Pack in more GPUs/CPUs with stable thermals and smaller footprints.
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Tight temperature controls extend component life, reduce hardware failures, and prevent performance throttling under peak demand. By minimizing thermal cycling and hotspots, liquid cooling ensures that your infrastructure delivers consistent, predictable performance even as workloads intensify.